SPS 2019 old

Tanja Braun studied mechanical engineering at Technical University of Berlin with a focus on polymers and micro systems and joined Fraunhofer IZM in 1999. Since 2000 she is working with the group Assembly & Encapsulation Technologies and since 2016 she is head of this group. In 2013 she received her Ph.D. degree from the Technical University of Berlin for the work focusing on humidity diffusion through particle-filled epoxy resins. Her field of research is process development of assembly and encapsulation processes, the qualification of these processes using both non-destructive and destructive tools and advanced polymer analysis. Recent research is focused on wafer and panel level packaging technologies and Tanja Braun is leading the Fan-out Panel Level Packaging Consortium at Fraunhofer IZM Berlin.

Tanja Braun 在柏林技术大学学习机械工程，专注于聚合物和微系统，并于1999年加入Fraunhofer IZM。自2000年以来，她一直与组装和封装技术集团合作，并自2016年起担任该集团的负责人。2013年，她获得了柏林技术大学的博士学位，主攻通过颗粒填充环氧树脂进行湿度扩散。她的研究领域是组装和封装工艺的工艺开发，使用无损和破坏性工具以及先进的聚合物分析对这些工艺进行鉴定。最近的研究集中在晶圆和面板级封装技术上，Tanja Braun领导着柏林Fraunhofer Izm的扇出面板级封装联盟。

Stress Analysis and Reliability Management in Advanced Packaging

Xuejun Fan
IEEE Distinguished Lecturer

Xuejun Fan is a Regents’ Professor of Texas State University System, and a Mary Ann and Lawrence E. Faust Endowed Professor at Lamar University, Beaumont, Texas. Dr. Fan is an IEEE Fellow, and an IEEE Distinguished Lecturer. He currently serves as a member-at-large of the IEEE Electronic Packaging Society (EPS) Board of Governors. Dr. Fan gained significant experience in the microelectronics industry between 1997 and 2007, at IME, Philips and Intel. His current areas of expertise include characterization, modeling and reliability of materials, components, and systems in micro- and opto-electronics manufacturing and packaging. He received the Outstanding Sustained Technical Contribution Award in 2017, and Exceptional Technical Achievement Award in 2011, from the IEEE Electronic Packaging Society. In his early academia career in China, Dr. Fan was the recipient of a Young Faculty Award from the Fok Ying-Tung Education Foundation in 1994, and the nominee for the title of “Ten Outstanding Youth of China” in 1991. He was one of the youngest full professors in China at the age of 27 at Taiyuan University of Technology in 1991.

樊学军是德州州立大学的杰出教授，也是德州博蒙特拉马尔大学的玛丽·安学院和劳伦斯·E·浮士德学院的客座教授。范博士是电气和电子工程师协会（IEEE)研究员，IEEE杰出讲师。他目前是IEEE电子封装协会（EPS）理事会的成员。
樊博士在1997年至2007年间，先后就职于IME、飞利浦和英特尔，获得了微电子行业丰富从业经验。他目前专注于：微电子和光电子学制造和封装领域的特性描述、建模、材料可靠性验证、零部件和系统的整合等。
他在2017年获得了IEEE电子封装协会颁发的杰出持续技术贡献奖，并在2011年获得了杰出技术成就奖。樊学军教授在中国的早期学术生涯中，曾获1994年度霍英东教育基金会青年教师奖，1991年度“十大杰出青年”称号被提名人之一。1991年，27岁的他是太原科技大学中国最年轻的正教授之一。

Technical Presentations

Tuesday December 17 - 13:00 - 17:30
Wednesday December 18 - 8:00 - 15:00

Confirmed Presenters Include

13:00 - 15:00

Session 1
Introduction, Keynote, & Market Overview

Opening Remarks

Tingyu Lin & Ira Feldman

Formal Welcome

Yang Haidong
GGDCNC

Keynote

Johan Liu
The Royal Swedish Academy of Sciences

Johan Liu，male，he received a master’s degree in 1984 and a doctorate in 1989 from KTH Royal Institute of Technology in Sweden.He is a chair professor of Chalmers University of Technology in Sweden, IEEE Fellow, academician of The Royal Swedish Academy of Sciences.

He has been selected as a special professor of the Yangtze River Scholars Program (short-term) and the National Thousand-Person Program (short-term), distinguished Professor of Shanghai University.

Deputy Editor of the International Journal of IEEE CPMT Transactions, one of the editorial board of the Journal Soldering & Surface Mount Technology and Journal Advance in Manufacture.Chief Scientist of Opel and Shenzhen Shenruimene.

He committed to nano-electronic materials and micro-nano manufacturing technology, especially heat dissipation materials, nano-electronic packaging technology and other research directions.

He Published 550 papers and chapters, including 80 papers in top journals such as Nature Communications, Advanced Materials, Advanced Functional Materials, Advanced Energy Materials, Small.citation times: 6400. H-index: 41. He has nearly 30 invention patents and 60 patent applications.

In 2004, he was awarded the Special Technology Achievement Award by the Devices and Packaging Branch of the American College of Electrical and Electronic Engineers (only one person per year).In 1996, he was awarded the Best Paper Award in Advanced Packaging Field by the American Journal of IEEE CPMT (only one person per year). He was co-chairman of China Electronic Packaging Conference from 2009 to 2018.

刘建影院士/Johan Liu（中英文对照）

刘建影，男，1984年获瑞典皇家理工学院硕士学位,1989年瑞典皇家理工学院获博士学位。现任瑞典查尔姆斯理工大学微系统和纳米科学学院讲座教授，IEEE Fellow，瑞典皇家工程科学院院士，入选“长江学者特聘教授”计划（短期）及国家“千人计划”（短期）, 上海大学特聘教授。

IEEE CPMT Transactions国际期刊副主编，Soldering & Surface Mount Technology期刊及Advance in　Manufacture杂志编委，欧泊及深圳深瑞墨烯首席科学家。

长期致力于纳米电子材料与微纳制造工艺的研究，特别是散热材料，纳米电子封装技术等方向的研究。发表550篇论文及章节，其中在Nature Communications, Advanced Materials、Advanced Functional Materials、Advanced Energy Materials, Small等顶级期刊上发表论文80篇，引用次数:6400。H-指数: 41。拥有近30项发明专利及60项专利申请。2004年获得美国电气电子工程师学院器件和封装分会“特殊技术成就奖” (每年只有一人获得)。1996年获得美国IEEE CPMT学报先进封装领域“最佳论文奖”，(每年只有一人获得)，2009至2018年中国电子封装大会共同主席。

Market Overview

Santosh Kumar
Yole

Santosh Kumar is currently working as Director & Principal Analyst at Yole Développement. He is involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. His main interest areas are advanced IC packaging technology including equipment & materials. He is the author of several reports on fan-out / fan-in WLP, flip chip, and 3D/2.5D packaging.

He received the bachelor and master degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.

Santosh Kumar目前在Yole development pement担任董事兼首席分析师。他主要从事微电子组装和封装技术的市场、技术和战略分析。他的主要研究领域是先进的集成电路封装技术，包括设备和材料，撰写了多篇关于扇出/扇入WLP、倒装芯片和3D/2.5D封装的报告。

他分别在印度理工学院(IIT)、罗基大学(Roorkee)和首尔大学(University of Seoul)获得工程学学士和硕士学位。在同行评审期刊上发表论文40余篇，获得专利2项。曾在许多与先进微电子封装有关的会议和技术研讨会上发言。

15:30 - 17:30

Session 2
Industry Status, IDM/Fabless Perspective

High Frequency Power Converters with 3D Package-embedded Inductors

Dr. Ziyang Gao
ASTRI

Dr. Ziyang GAO is a Director of the 3D Integration CCG of the Integrated Circuits and Systems (ICS) Technology Division in ASTRI. He received his B.S. Degree from the University of Science & Technology of China (USTC) and his Ph.D Degree from the Hong Kong University of Science and Technology (HKUST). He had worked at the Chinese Academy of Sciences (CAS), HKUST, and joined ASTRI in 2006.

Currently he is leading the 3DI CCG to develop power electronics solutions by leveraging 3D integration technologies for telecommunication, data centers and other power conversion applications. He also serves as the technical committee member of the International Conference on Electronic Packaging Technology (ICEPT) and the International Technology Roadmap for Wide-bandgap Semiconductors (ITRW). He published 28 peer-reviewed international journal & conference papers and filed 34 US and CN patent applications with three of them awarded two Gold medals and one Silver medal in the 46th & 47th International Exhibition of Innovations in Geneva.

Challenge on Electronic Packaging

Tonglong Zhang / 张童龙
HiSilicon

Tonglong Zhang has more than 20 years’ experience in IC packaging development. He worked in a world top design house for 10 years and two OSATs for a total of 10 years. In addition, he worked in IDM for more than 3 years. He built up Cu pillar flipchip capability from zero to HVM within 1.5 years. He developed various new package technologies. He is also experienced in IC package design, FEA stress and thermal analysis. He have 11 US patents and more than 10 Chinese patents.

张童龙拥有20多年的集成电路封装开发经验。他在一家世界顶级设计公司OEM工作了10年，在两个OSAT公司工作了10年。此外，他在 IDM领域工作了3年多。他在1.5年内将铜柱倒装芯片的能力从零提高到HVM级别。他开发了各种新的封装技术。他在集成电路封装设计，有限元应力和热分析方面也很有经验。他拥有11项美国专利和10多项中国专利。

Fan Out Development and Solutions

Thorsten Meyer
Infineon

Thorsten Meyer is Lead Principal Engineer Package Concept Engineering at Infineon Technologies in Regensburg, Germany, responsible for New Package concepts. Until March 2015 he was leading the Package Technology and Innovation department at Intel Mobile Communications (IMC) in Regensburg. Prior joining IMC,
he was overall project leader for the development of Wafer Level Packaging Technologies at Infineon in Regensburg and earlier in Dresden.

Thorsten is author of multiple publications and holds more than 150 patents and patent applications in the area of advanced packaging.

Thorsten Meyer是英飞凌科技公司（位于德国雷根斯堡）的首席封装理念工程师，，负责研发新的封装理念。直到2015年3月，他一直领导着英特尔移动通信（IMC）（位于德国雷根斯堡）的软件封装技术与创新部门。在加入IMC之前，他曾在英飞凌公司和德累斯顿公司担任晶圆级封装技术开发的总体项目负责人。Thorsten Meyer是多个出版物的作者，在先进封装领域拥有150多项专利和专利申请。

17:30 - 18:30

Networking Reception in EXPO area

Adjourn

8:30 - 10:00

Session 3
OSAT & Packaging Technology

Development of eSiFO Gat Huatian

Dr. Yu Daquan
Infineon

Dr. Yu Daquan gained the doctorate and graduated from Dalian University of Technology in 2004.
He has successively carried out scientific research at City University of Hong Kong, German Institute of Micro-integration and Reliability, and Singapore Institute of Microelectronics.
In 2010, he returned to China as a researcher of Institute of Microelectronics, Chinese Academy of Sciences.After that ,He servedTianshui Huatian Technology Group as the CTO as well as the dean of the Institute of Packaging Technology.

He was the general manager of Xiamen Yuntian Semiconductor Technology Co., Ltd.

Minjiang Scholar of Xiamen University selected him as a distinguished professor in December 2018.

Dr. Yu Daquan has been engaged in the research and industrialization of advanced microelectronic packaging technology for many years.

He has published more than 170 academic papers and authorized more than 50 invention patents. Dr. Yu Daquan is a senior member of IEEE.

He has been selected as the leader of “Double Creative Talents” and “Double Creative Team” in Jiangsu Province (2016).

于大全（中英文对照）

博士，2004年博士毕业于大连理工大学。先后在香港城市大学、德国夫豪恩霍夫微集成与可靠性研究所、新加坡微电子研究所开展科研工作。
2010年回国后先后担任中国科学院微电子研究所研究员，天水华天科技集团CTO、封装技术研究院院长，厦门云天半导体科技有限公司总经理，2018年12月入选厦门大学闽江学者特聘教授。于大全博士多年来一直从事先进微电子封装技术研究与产业化工作，发表学术论文170多篇，授权发明专利50多项。于大全博士是IEEE高级会员，曾入选江苏省“双创人才”和“双创团队”领军人才（2016）。

10:30 - 12:00

Session 4
Materials

Total Solution for Fan Out Panel Level Packaging

Toshihisa Nonaka
Hitachi Chemicals

He graduated from the University of Tokyo in 1986 and received Ph. D degree in 1995 from Nagoya University. He has been working in the research of electronic materials more than 30 years. From 1986-2015 he had been worked in Toray industries. Since 2015 he has been a technical director of Packaging Solution Center of Hitachi Chemical.
Current his research topic is process and material development of advance package regarding FO-WLP/PLP, 2.5D, 3D and so on.