
International Semiconductor Panel Symposium (SPS) 2019
Nanhai Jiayia International Hotel
Foshan China
No.55 Middle Bo'ai Road (Bo'ai Zhong Lu),
Shishan Town Nanhai District Foshan
528225 China
For the first time, Guangdong Semiconductor Intelligent Equipment and System Integration Innovation Center (FZX), TestConX, Hong Kong Science and Technology Research Institute (ASTRI), and MicroElectronics Packaging and Test Engineering Council (MEPTEC) co-organize the International Semiconductor Panel Symposium (SPS 2019) focused on Panel Level Advanced Packaging & System Integration Technology. This symposium is an unparalleled gathering of the leading executives from around the world discussing the timeliest issues, challenges and opportunities. The unique single-meeting event will take place in one of the most dynamic places in the field of advanced packaging: FoShan , Guangdong Province, PR China, from December 17 to 18, 2019.
Tuesday December 17, 2019
8:00
Registration Opens
9:00
Welcome & Short Courses
Welcome Speech
Dr Cui Chengqiang
Guangdong Semiconductor Intelligent Equipment and System Integration Innovation Center (FZX)
The Opening Ceremony of Guangdong Semiconductor Intelligent Equipment and System Integration Innovation Center
Launch of the Large PLFO assembly Line
9:40

From Wafer to Panel Level Packaging
Tanja Braun
Fraunhofer IZM Berlin
10:40
Networking Tea Break
11:00

Stress Analysis and Reliability Management in Advanced Packaging
先进封装中应力分析及可靠性管理
Xuejun Fan
IEEE Distinguished Lecturer
12:00
Lunch and Networking
For paid short course atttendees and presenters.
13:30
Keynote

Keynote: Challenge on New Materials of Electronic Packaging
Johan Liu
Royal Swedish Academy of Sciences
Introduction of Guangdong Semiconductor Intelligent Equipment and System Integration Innovation Center (FZX)
Dr. Cui Chengqiang
Guangdong Semiconductor Intelligent Equipment and System Integration Innovation Center (FZX)
15:00
Tea Break
15:20
Session 1

SEMI Standards: Update on Panel Level Packaging Standardization
Isadora Jin
SEMI

High Frequency Power Converters with 3D Package-embedded Inductors
Dr. Ziyang GAO
Hong Kong Science and Technology Research Institute (ASTRI)

Challenge on Electronic Packaging
Tonglong Zhang / 张童龙
HUAWEI-
HiSilicon

Wet Coating Technique for Panel Level Package
Koichi Jono
SCREEN,
Finetech Solutions Co., Ltd.
18:00
Networking Reception
For all attendeesWednesday December 18, 2019
8:00
Registration Opens
8:30
Session 2

Advanced Material Development
Toshihisa Nonaka
Hitachi Chemicals
High Performance Base Materials for IC Substrate & Packaging
Yang Zhongqiang
SYTECH
Materials - to be announced
Dr Yuan Mingjun
GUANGHUA TECHNOLOGY
10:30
Tea Break
10:45
Session 3

Applications of Micro-Analysis in the
Electronics Industry for Failure Analysis -
From Material to Device
Lin Nan
EDAX

Exploring the Regional Semiconductor Industry Ecology in Post-Moore Era
Wang Huilian/王汇联
Xiamen Semiconductor Investment Group Co., Ltd
12:00
Lunch and Networking
13:35
Session 4

FOPLP Solution for Cu
RDL Formation
Dr. Richard Tsai
MANZ